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Another new addition to our range is the SP2200 solder paste from Stannol. SP2200 solder paste was developed for lead-free SMD electronics manufacturing using stencil printing. It can be used in all standard open and closed printing systems and is suitable for fine pitch printing as low as 0.4mm.
Stannol's No-Clean SP2200 solder paste is activated as type L0. This activation level ensures good wetting combined with a high level of electrical safety on all surfaces used in modern electronics. In addition to the long open time, the paste immediately shows excellent print definition even after long printer downtimes. It also demonstrates high tackiness for use in high-speed pick-and-place equipment. The minimal residues left after the reflow process are bright, transparent, electrically safe, and do not have to be removed. Stannol SP2200 no-clean solder paste thus meets the requirements of practically every modern series production system.
Comprehensive technical specifications, current prices and inventory, and downloadable datasheets can be found in product group:
R5261 - STANNOL Solder Paste SP No-clean Lead-free |
