MOQ (minimum order quantity) PU (Price unit): E (item), H (100 items), T (1000 items), p (pair), P (pack), k (kilogram), h (100 meters) RRP recommended retail price. Stock and prices are updated on an hourly basis. After Registration and Login you will see your individual customer prices and CSV file upload, watchlists and requestlist are accessible in the Customer Portal. All prices are net excluding V.A.T. We do not deliver to private end-users.
• Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components • Application for printed circuit boards, electronic components, control assemblies
• As a contact paste when installing electronic components to ensure the highest possible heat transfer from semiconductors to the cooling surfaces.
Features
• Two-phase mixing system whose base is a polydimethylsiloxane with low viscosity temperature curve • Incorporated filler ensures optimum heat dissipation • Extreme temperature and oxidation resistance • Low consistency change over a wide temperature range • Hydrophobicity • Excellent dielectric properties
